Corfin Industries has announced a strategic combination with Micross Components, a provider of mission-critical microelectronic components and services for high-reliability markets, as part of a transaction led by Corfin’s current majority shareholder Behrman Capital. Financial terms of the transaction have not been disclosed.
Headquartered in Orlando, Florida, Micross serves the aerospace, defence, space, medical, and industrial markets, among others. The company offers an industry-leading portfolio of high-reliability components and services that include advanced component testing, qualification services, packaging services, standard wafer bumping, advanced wafer level packaging services, and 3D integration. Micross has longstanding relationships with blue-chip customers in each of its end markets and more than 30 of the world’s leading semiconductor manufacturers. The company maintains manufacturing operations across the US and Europe.
Grant Behrman, Managing Partner of Behrman Capital, says: “Corfin and Micross are highly complementary businesses that together will be a differentiated service provider in the high-reliability electronics market with industry-leading breadth and quality of capabilities. The combination provides product and service extensions across a variety of markets that have been strategic priorities since our investment in Corfin. We look forward to the combined company’s exciting next chapter of growth.”
Richard Kingdon, Chief Executive Officer of Micross, says: “We are proud of the value that Micross has continued to provide for its customers through our unmatched portfolio of products and services that has been assembled over our 40+ year history. Joining forces with Corfin presents a compelling opportunity to realise our numerous growth prospects and continue our unwavering commitment to quality.”