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Rayspan raises USD12.5m from Khosla Ventures and Sequoia Capital

Rayspan, an innovator of metamaterial air interface solutions for wireless communications, has received USD12.5m in a series B financing led by new investor Khosla Ventures and includin

Rayspan, an innovator of metamaterial air interface solutions for wireless communications, has received USD12.5m in a series B financing led by new investor Khosla Ventures and including existing investor Sequoia Capital as well as individual private investors.

The financing will be used by Rayspan to accelerate and expand the development and commercialization of its breakthrough metamaterial wireless technology.

"Rayspan is on track to global leadership in developing and commercializing the exciting new field of metamaterials for wireless communications," says Pierre Lamond, general partner at Khosla Ventures. "Their advanced and proprietary technology is strongly differentiated and market-proven, and we believe they will become an industry-leading air interface provider in the huge wireless markets they target."

"Rayspan is delighted to have Khosla Ventures join its shareholders," says Franz Birkner, chief executive of Rayspan. "Their support, together with that of Sequoia Capital, is a clear vote of confidence in Rayspan’s exciting opportunity to broadly deploy its breakthrough metamaterial air interface solutions in the world’s largest WLAN and 2/3/4G cellular handset markets."

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